IEEE/ACM International Symposium on Quality of Service
25-28 June 2021 // Tokyo, Japan

Committee

Organizing Committee

General Chair

Hitoshi Asaeda, NICT, Japan

Jiannong Cao, The Hong Kong Polytechnic University, China

PC Chair

Ruidong Li, Kanazawa University, Japan

Wenjing Lou, Virginia Tech, USA

Local Chair

Jiro Katto, Waseda University, Japan

Miki Yamamoto, Kansai University, Japan

Poster Chair

Yuki Koizumi, Osaka University, Japan
Tian Wang, Beijing Normal University & UIC, China

Web Chair

Meng Shen, Beijing Institute of Technology, China

Publicity Chair

Wei Wang, San Diego State University, USA

Paolo Bellavista, University of Bologna, Italy

Noriaki Kamiyama, Fukuoka University, Japan

Deze Zeng, China University of Geosciences, China

Finance Chair

Ryoichi Shinkuma, Kyoto University, Japan

Carmen Au, The Hong Kong Polytechnic University, Hong Kong

Publication Chair

Fangxin Wang, The Chinese University of Hongkong, China

Steering Committee

Ke Xu (Chair), Tsinghua University, China

Jiangchuan Liu (Past Chair), Simon Fraser University, Canada

Zongpeng Li, University of Calgary, Canada

Chuan Wu, University of Hong Kong, China

Tian He, University of Minnesota, USA

Jian Tang, Syracuse University, USA

Xue Liu, McGill University, Canada

Tommaso Melodia, Northestern University, USA

Dan Wang, The Hong Kong Polytechnic University, China

Technical Program Committee

Tarek Abdelzaher, University of Illinois, Urbana Champaign, USA

Rui Aguiar, University of Aveiro, Portugal

Masaki Aida, Tokyo Metropolitan University, Japan

Wei Bao, The University of Sydney, Australia

Abderrahim Benslimane, University of Avignon, France

Kaigui Bian, Peking University, China

Robert Birke, ABB Corporate Research, Switzerland

Cristian Borcea, New Jersey Institute of Technology, USA

Torsten Braun, University of Bern, Switzerland

Eduardo Cerqueira, Federal University of Para & UCLA, Brazil

Octav Chipara, University of Iowa, USA

Nakjung Choi, Nokia-Bell Lab, USA

Domenico Ciuonzo, University of Naples Federico II, Italy

Noel Crespi, Institut Mines-Télécom, Télécom SudParis, France

Ruben Cuevas Rumin, Universidad Carlos III de Madrid, Spain

Haipeng Dai, Nanjing University, China

Giuseppe Di Modica, University of Bologna, Italy

Yingfei Dong, University of Hawaii, USA

Serge Fdida, Sorbonne University, France

Nelson L. S. da Fonseca, State University of Campinas, Brazil

Valerio Frascolla, Intel Deutschland Gmbh, Germany

Chenfei Gao, AT&T Labs – Research, USA

Yacine Ghamri-Doudane, University of la Rochelle, France

Lin Gu, Huazhong University of Science and Technology, China

Zhangyu Guan, University at Buffalo, USA

Zehua Guo, Beijing Institute of Technology, China

Jinsong Han, Zhejiang University, China

Go Hasegawa, Tohoku University, Japan

Michiaki Hayashi, KDDI Research Inc., Japan

Hongxin Hu, Clemson University, USA

Dijiang Huang, Arizona State University, USA

Pan Hui, Hong Kong University of Science and Technology, Hongkong

Mingyue Ji, University of Utah, USA

Chunxiao Jiang, Tsinghua University, China

Lei Jiao, University of Oregon, USA

Gunnar Karlsson, KTH Royal Institute of Technology, Sweden

JongWon Kim, GIST (Gwangju Institute of Science & Technology), Korea

Linghe Kong, Shanghai Jiao Tong University, China

Taekyoung Kwon, Seoul National University, Korea

Dongman Lee, Korea Advanced Institute of Science and Technology, Korea

Patrick Pak-Ching Lee, The Chinese University of Hong Kong, Hongkong

Baochun Li, University of Toronto, Canada

Jian Li, Binghamton University-SUNY, USA

Tao Li, Indiana University-Purdue University Indianapolis, USA

Zhenjiang Li, City University of Hong Kong, Hongkong

Fangming Liu, Huazhong University of Science and Technology, China

Jia Liu, Nanjing University, China

Zhi Liu, The University of Electro-Communications, Japan

Li Lu, Zhejiang University, China

Rongxing Lu, University of New Brunswick, Canada

Xiapu Luo, The Hong Kong Polytechnic University, Hongkong

Yan Ma, Bejing University of Posts and Telecommunications, China

Pietro Manzoni, Universitat Politècnica de València, Spain

Constandinos Mavromoustakis, University of Nicosia, Cyprus

Di Niu, University of Alberta, Canada

Yasuo Okabe, Kyoto University, Japan

Sangheon Pack, Korea University, Korea

Miao Pan, University of Houston, USA

Dan Pei, Tsinghua University, China

Kandaraj Piamrat, LS2N / University of Nantes, France

Zhan Qin, Zhejiang University, China

Yuben Qu, Shanghai Jiao Tong University, China

Kaliappa Ravindran, City University of New York, USA

Danda Rawat, Howard University, USA

Shaolei Ren, University of California, Riverside, USA

Francesco Restuccia, Northeastern University, USA

Abusayeed Saifullah, Wayne State University, USA

Stefan Schmid, University of Vienna , Austria

Stefano Secci, Cnam, France

Meng Shen, Beijing Institute of Technology, China

Hiroshi Shigeno, Keio University, Japan

Hideyuki Shimonishi, NEC, Japan

Simone Silvestri, University of Kentucky, USA

Houbing Song, Embry-Riddle Aeronautical University, USA

Hideki Tode, Osaka Prefecture University, Japan

Eirini Eleni Tsiropoulou, University of New Mexico, USA

Keisuke Uehara, Keio University, Japan

Cong Wang, City University of Hong Kong, Hongkong

Dan Wang, The Hong Kong Polytechnic University, Hongkong

Haiyang Wang, University of Minnesota at Duluth, USA

Wei Wang, Hong Kong University of Science and Technology, Hongkong

Weichao Wang, University of North Carolina at Charlotte, USA

Xinbing Wang, Shanghai Jiaotong University, China

Yi Wang, Southern University of Science and Technology, China

Wei Wei, Xi’an University of Technology, China

Yonggang Wen, Nanyang Technological University, Singapore

Tilman Wolf, University of Massachusetts Amherst, USA

Chuan Wu, The University of Hong Kong, Hongkong

Fan Wu, Shanghai Jiao Tong University, China

Hongyi Wu, Old Dominion University, USA

Kui Wu, University of Victoria, Canada

Yuan Wu, University of Macau, China

Chaocan Xiang, Chongqing University, China

Qiao Xiang, Yale University, USA

Yang Xiao, The University of Alabama, USA

Shengjie Xu, Dakota State University, USA

Kaiping Xue, University of Science and Technology of China, China

Jie Yang, Florida State University, USA

Panlong Yang, University of Science and Technology of China, China

David Yau, Advanced Digital Sciences Center, Singapore

Fan Ye, Stony Brook University, USA

Feng Ye, University of Dayton, USA

Shui Yu, University of Technology Sydney, Australia

Huacheng Zeng, Michigan State University, USA

Beichuan Zhang, University of Arizona, USA

Haijun Zhang, University of Science and Technology Beijing, China

Hongwei Zhang, Iowa State University, USA

Shigeng Zhang, Central South University, China

Weiyi Zhang, AT&T Research, USA

Xinggong Zhang, Peking University, China

Yanchao Zhang, Arizona State University, USA

Yuchao Zhang, Beijing University of Posts and Telecommunications, China

Zhi-Li Zhang, University of Minnesota, USA

Jiaqi Zheng, Nanjing University, China

Xiaolong Zheng, Beijing University of Posts and Telecommunications, China

Ruiting Zhou, Wuhan University, China

Zhi Zhou, Sun Yat-sen University, China